微米行程微膨胀型热开关热特性的仿真与试验

张旭升; 郭亮; 贾卓杭; 马明朝; 李义; 吴清文

doi:10.3788/OPE.20162410.2442

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微米行程微膨胀型热开关热特性的仿真与试验

微纳技术与精密机械 | 更新时间：2020-07-07

- 微米行程微膨胀型热开关热特性的仿真与试验
- Simulation and experiment of thermal properties for micro-expansion type heat switch with micron stroke
- 光学精密工程 2016年24卷第10期页码：2442-2448
- 作者机构：
  
  1.中国科学院长春光学精密机械与物理研究所, 吉林长春 130033
  2.中国科学院大学, 北京 100049
- 作者简介：
  
  张旭升(1988-),男,黑龙江讷河人,硕士,助理研究员。2013年于哈尔滨工业大学获得硕士学位,主要从事红外热辐射传输、航天器热控技术等方面研究。E-mail:zxs1933@126.com
  [ "郭亮(1982-),男,黑龙江哈尔滨人,博士,副研究员。2006年于哈尔滨工业大学获得硕士学位,2013年于中国科学院大学获得博士学位,主要从事传热传质学、空间机构环境适应性、空间光学遥感器热控技术等方面研究。E-mail:guoliang329@hotmail.com" ]
- 基金信息：
  
  中国科学院长春光学精密机械与物理研究所空间机器人中心创新基金资助项目(No.SRCX2013001)
- DOI：10.3788/OPE.20162410.2442
  中图分类号： V444.36;TK124
- 收稿日期：2016-02-05，
  
  录用日期：2016-3-17，
  
  纸质出版日期：2016-10
- 稿件说明：
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张旭升, 郭亮, 贾卓杭, 等. 微米行程微膨胀型热开关热特性的仿真与试验[J]. 光学精密工程, 2016,24(10):2442-2448.

Xu-sheng ZHANG, Liang GUO, Zhuo-hang JIA, et al. Simulation and experiment of thermal properties for micro-expansion type heat switch with micron stroke[J]. Optics and precision engineering, 2016, 24(10): 2442-2448.
张旭升, 郭亮, 贾卓杭, 等. 微米行程微膨胀型热开关热特性的仿真与试验[J]. 光学精密工程, 2016,24(10):2442-2448. DOI： 10.3788/OPE.20162410.2442.

Xu-sheng ZHANG, Liang GUO, Zhuo-hang JIA, et al. Simulation and experiment of thermal properties for micro-expansion type heat switch with micron stroke[J]. Optics and precision engineering, 2016, 24(10): 2442-2448. DOI： 10.3788/OPE.20162410.2442.

摘要

为了提高空间热控分系统的散热调节能力和热环境适应性，设计了一种微米行程的微膨胀型热开关。介绍了热开关的结构组成和工作原理，通过理论-仿真-试验相结合的方式，计算评估了热开关的断开热阻、闭合热阻和开关比等关键热特性。依据热阻网络串并联关系计算热开关的理论特性，断开热阻为301.71 K/W，闭合热阻为1.06 K/W，开关比约为283.6。基于有限元模型分析热开关断开/闭合过程的瞬态热特性，热端发热功率为18 W时，热开关闭合响应时间为340 s，触发温度为35.5℃，闭合热阻约为2.3 K/W。在2次热开关性能测试试验中，闭合热阻和开关比分别为1.08 K/W、279.4和1.67 K/W、180.7，试验数据与理论计算高度一致。同时指出：装配调试过程的不确定性会造成微膨胀型热开关宏观热特性的小区域波动。本文工作可为后续微膨胀型热开关的结构优化设计、机械加工细化和装调方式改进提供参考。

Abstract

To improve the heat-dissipation regulation capability and thermal environment adaptability of space thermal control subsystem

a micro-expansion type heat switch with micron stroke was designed. The structural components and operating principle of the switch were introduced

and the key thermal properties of heat switch

including OFF resistance

ON resistance and ON/OFF ratio

were evaluated by combination of theory

simulation and experiments. Theoretical thermal properties of heat switch is calculated based on the series-parallel relationship of thermal resistances

the OFF resistance and ON resistance are 301.71 K/W and 1.06 K/W

respectively

the ON/OFF ratio is about 283.6. Transient thermal properties of the OFF/ON process was analyzed by the finite element model

when the heating power of hot end is 18 W

the turn-ON response time and triggering temperature are 340 s and 35.5℃

and the ON resistance is about 2.3 K/W. Moreover

in the twice property experiments

the ON resistance and ON/OFF ratio are 1.08 K/W

279.4 and 1.67 K/W

180.7 respectively

and experimental data is in agreement with the theoretical calculations well. The experimental results point out that the uncertainty of assembly-regulation process would cause small interval fluctuations of macro thermal properties of the heat switch

The conclusions cloud provide references for structural optimization design

machining refinement and assembly-regulation improvement of subsequent micro-expansion type heat switches.

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